The MediaTek Dimensity 9000 SoC is the next flagship processor to face Qualcomm’s top-tier Snapdragon chipset. It’s the first mobile chipset made using TSMC’s 4nm technology. Moreover, it’s the first processor to use Arm’s new version 9 architecture.
What’s more, the MediaTek Dimensity 9000 SoC is equipped with a 10-core ARM Mali-G710 GPU and six fifth-generation APU cores for AI computation. The new flagship SoC also includes an 18-bit Imagiq Gen 7 ISP. Mediatek claims it to be the first to capture a 320-megapixel image in the world. On top of that, it also features Wi-Fi 6E and Bluetooth v5.3 support.
The first smartphone to be powered by the MediaTek Dimensity 9000 SoC is expected to debut in late Q1 2022, according to the company. The chipset features one ARM Cortex-X2 processor running at 3.05GHz. Plus, it also features three ARM Cortex-A710 processors running at up to 2.85GHz, and four ARM Cortex-A510 processors. The hardware also supports LPDDR5x 7500Mbps.
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As previously stated, the MediaTek Dimensity 9000 SoC features a flagship 18-bit HDR-ISP design that allows for simultaneous HDR video capture from three cameras. It also adds support for smartphones with 320-megapixel cameras. When compared to the previous generation, the new six-core fifth-generation AI processing unit is expected to provide a 4X power efficiency boost.
MediaTek Dimensity 9000 Includes ARM Mali-G710 GPU
The ARM Mali-G710 graphics processor is included in the MediaTek Dimensity 9000 SoC. The chipset boasts an industry-first Vulkan raytracing SDK for Android. It will also support full-HD+ displays with a refresh rate of 180Hz. The Dimensity 9000 includes the world’s first 5G smartphone modem based on the 3GPP Release-16 standard. It includes an integrated 5G modem with downlink speeds of up to 7Gbps, 3CC Carriers Aggregation (300MHz), and uplink speeds of up to 300 percent faster.
As for connectivity, the chipset includes Bluetooth 5.3, Wi-Fi 6E 22, Wireless Stereo Audio, and Beidou III-B1 C GNSS capabilities.
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